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Journal of Materials Science

Volumn 44, Issue 9, 2009, Pages 2257-2263

The effect of ball milling on the melting behavior of Sn-Cu-Ag eutectic alloy

(4) Reddy, Bhupal a Bhattacharya, P a Singh, Bawa b Chattopadhyay, K a

a INDIAN INSTITUTE OF SCIENCE (India)

b Cookson Electronics Assembly Materials ^* (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC INDUSTRIES; EUTECTIC ALLOYS; GRAIN SIZES; LOW TEMPERATURES; MECHANICAL MILLINGS; MELTING BEHAVIORS; METALS AND ALLOYS; NANOSTRUCTURED ALLOYS; PB-FREE; ROOM TEMPERATURES; SN-AG-CU; SOLDER ALLOYS;

ALLOYS; BALL MILLING; BALL MILLS; CERIUM ALLOYS; COPPER ALLOYS; LEAD; MECHANICAL ALLOYING; METAL MELTING; MILLING (MACHINING); SILVER; SILVER ALLOYS; SMELTING; SOLDERING ALLOYS; STEELMAKING; THERMOCHEMISTRY; TIN; TIN ALLOYS;

MELTING POINT;

EID: 64949164116 PISSN: 00222461 EISSN: 15734803 Source Type: Journal
DOI: 10.1007/s10853-008-3146-4 Document Type: Conference Paper

Times cited : (16)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.