Effects of cerium on Sn-Ag-Cu alloys based on finite element simulation and experiments

Journal of Rare Earths

Volumn 27, Issue 1, 2009, Pages 138-144

  ZHANG, Liang ^a   XUE, Songbai ^a   CHEN, Yan ^b   HAN, Zongjie ^a   WANG, Jianxin ^a   YU, Shenglin ^a,c   LU, Fangyan ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b HARBIN WELDING INSTITUTE   (China)

^c CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

cerium reliability; creep model; intermetallic compound; rare earths; tensile strength

Indexed keywords

ALLOYS; BRAZING; CERIUM; CERIUM ALLOYS; CERIUM COMPOUNDS; COPPER ALLOYS; CREEP; CREEP RESISTANCE; MECHANICAL PROPERTIES; MECHANICAL TESTING; RARE EARTHS; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SPECTROMETERS; STRENGTH OF MATERIALS; TENSILE STRENGTH; TIN; TIN ALLOYS; WELDING;

CREEP DEFORMATIONS; CREEP MODEL; CU SUBSTRATES; ENERGY-DISPERSIVE X-RAY FLUORESCENCES; FINITE ELEMENT SIMULATIONS; FINITE ELEMENTS; HIGH STRESS; INTERMETALLIC COMPOUND; INTERMETALLIC COMPOUND LAYERS; LOW STRESS; MICROSTRUCTURAL ANALYSIS; SCANNING ELECTRON MICROGRAPHS; SN-AG-CU; SN-AG-CU ALLOYS; SN-AG-CU SOLDERS; SOLDER JOINTS; X-RAY DIFFRACTIONS;

SOLDERING ALLOYS;

EID: 62349137545     PISSN: 10020721     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1002-0721(08)60208-2     Document Type: Article

References (36)

1. Xue S., Chen Y., Lv X., and Liao Y. Effect of cerium on wettability and mechanical properties of soldered joints for SnAgCu lead free solder. Transactions of the China Welding Institution 26 10 (2005) 1 (in Chin.)
2. Kim K.S., Huh S.H., and Suganuma K. Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints. Journal of Alloys and Compounds 352 1-2 (2003) 226
3. Qi L., Huang J., Zhang J., and Wang Y. Growth behavior of intermetallic compounds on Sn-3.5Ag-0.5Cu/Cu(Ni) interface under thermal-shearing cycling condition. Rare Metal Materials and Engineering 36 2 (2007) 241 (in Chin.)
4. Vandevelde B., Gonzalez M., Limaye P., Ratchev P., and Beyne E. Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison for several IC-packages. Microelectronics Reliability 47 2-3 (2007) 259
5. Wu C.M.L., Yu D.Q., Law C.M., and Wang L. Properties of lead-free solder alloys with rare earth element additions. Materials Science and Engineering: R: Reports 44 1 (2004) 1
6. Wu M., and Liu Z. Effect of La on microstructure and property of Sn3.5Ag0.5Cu solder. Chinese Rare Earths 28 6 (2007) 58 (in Chin.)
7. Zhang K., Wang Y., Fan Y., Zhu Y., Zhang X., and Yan Y. Effect of Ce-La mixed rare contents and environment conditions on the creep rupture life of SnAgCu solder joints. Rare Metal Materials and Engineering 36 8 (2007) 1473 (in Chin.)
8. Qi L, Zhao J, Wang X M, Wang L. The effect of Bi on the IMC growth in Sn-3Ag-0.5Cu solder interface during aging process. International Conference on the Business of Electronic Product Reliability and Liability, Shanghai, China, 2004. 42.
9. Hirano T, Fukuda K, Ito K, Kiga T, Taniguchi Y. Reliability of lead free solder joint by using chip package. IEEE International Symposium on Electronics and the Environment, Denver, Co, USA 2001. 285.
10. Rizivi M.J., Chan Y.C., Bailey C., and Islam M.N. Effect of adding 1 wt% Bi into the Sn-2.8Ag-0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds 407 1-2 (2006) 208
11. Meng G., Yang T., and Chen L. Microstructure and melting property of Sn-2.5Ag-0.7Cu-XGe solder. Transactions of the China Welding Institution 28 10 (2007) 65 (in Chin.)
12. Mattila T T, Kaloinen E, Syed A, Kivilahti J K. Reliability of SnAgCu interconnections with minor additions of Ni or Bi under mechanical shock loading at different temperatures. Electronic Components and Technology Conference, Sparks, Nevada, USA 2007. 381.
13. Hsu Y.C., Huang Y.M., and Wang H. Interfacial reaction and shear strength of Pb-free SnAg2.5Cu0.8Sb0.5 and SnAg3.0Cu0.5Sb0.2 solder bumps on Au/Ni (P) metallization. Journal of Alloys and Compounds 417 1-2 (2008) 180
14. Xue S., Wu Y., Han Z., and Wang J. Effects of lead widths and pitches on reliability of quad flat package (QFP) soldered joints. Chinese Journal of Mechanical Engineering 20 4 (2007) 40
15. Zhang L., Xue S., Lu F., and Han Z. Numerical simulation on soldered joints of QFP device with different substrate materials and thickness. Transactions of the China Welding Institution 29 1 (2008) 35 (in Chin.)
16. Qian Y.Y., Ma X., and Yoshida F. Finite element analysis of stress-strain distribution characteristics in SMT solder joints (II)-Dominant mechanical factor responsible for failure of solder joint. The Chinese Journal of Nonferrous Metals 10 3 (2000) 411 (in Chin.)
17. Lau J., and Dauksher W. Reliability of an 1657CCGA (ceramic column grid array) package with 95.5Sn3.9Ag0.6Cu lead-free solder paste on PCBS (printed circuit boards). Journal of Electronic Packaging 127 2 (2005) 96
18. Zhang L., Xue S., Zeng G., Han Z., and Yu S. Study on mechanical properties and numerical simulation of fine pitch devices soldered joints. Transactions of the China Welding Institution 29 10 (2008) 31 (in Chin.)
19. Wu Z.H., Huang C.Y., and Zhou D.J. Study on solder joint reliability of ceramic ball grid array component based on design of experiment method. China Welding 15 3 (2006) 68
20. Li R.S. A methodology for fatigue prediction of electronic components under random vibration load. Journal of Electronic Packaging 123 4 (2001) 394
21. Knecht S., and Fox L.R. Constitutive relation and creep-fatigue life model for eutectic tin-lead solder. IEEE Transactions on Components, Hybrids, and Manufacturing Technology 13 2 (1990) 424
22. Chen Z.G., Shi Y.W., and Xia Z.D. Constitutive relations on creep for SnAgCuRE lead-free solder joints. Journal of Electronic Materials 33 9 (2004) 964
23. Zhang L., Xue S., Lu F., Han Z., and Wang J. Numerical simulation of soldered joints and reliability analysis of PLCC components with J-shape leads. China Welding 17 2 (2008) 37
24. Lee R.S.W., and Zhang X.W. Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading. Circuit World 24 3 (1998) 26
25. Kim J.W., and Jung S.B. Experimental and finite element analysis of the shear speed effects on the Sn-Ag and Sn-Ag-Cu BGA solder joints. Materials Science and Engineering 371 1-2 (2004) 267
26. Qi Y., Ghorbani H.R., and Spelt J.K. Thermal fatigue of SnPb and SnAgCu resistor joints: analysis of stress-strain as a function of cycle parameters. IEEE Transactions on Advanced Packaging 29 4 (2006) 690
27. Gao Q., Zhao M., and Wang H.F. SMT solder joint's semi-experimental fatigue model. Mechanics Research Communications 32 3 (2005) 351
28. Qian Z.F., and Sheng L. On the life prediction and accelerated testing of solder joints. The International Journal of Microcircuits and Electronic Packaging 22 4 (1999) 288
29. Zhang L., Xue S., Lu F., and Han Z. Finite element analysis on soldered joint reliability of QFP device with different solders. Transactions of the China Welding Institution 28 10 (2007) 45 (in Chin.) 52.
30. Li X.Y., and Wang Z.S. Thermo-fatigue evaluation of SnAgCu solder joints in flip chip assemblies. Materials Processing Technology 183 1 (2007) 6
31. Han Z., Xue S., Liu L., Wang J., Wu Y., Huang X., and Wang H. Effects of micro-amount of cerium on microstructures of SnAgCu solder and soldered joint. Journal of Rare Earths 24 S (2006) 228
32. Dunford S, Cannumalla S, Viswanadham P. Intermetallic morphology and damage evolution under thermomechanical fatigue of lead (Pb)-free solder interconnections. Electronic Components and Technology Conference, Las Vegas, USA 2004. 726.
33. Zheng Y.Q. Effect of surface finishes and intermetallics on the reliability of SnAgCu interconnects (2005), University of Maryland, Maryland, USA 40
34. Shangguan D.K. Lead-Free Solder Interconnect Reliability (2008), Publishing House of Electronics Industry, Beijing, China 35
35. Ju G., Wei X., Sun P., and Liu J. Effects of interfacial IMC on tensile fracture behavior of Sn-3.0Ag-0.5Cu solder joints on copper substrates. The Chinese Journal of Nonferrous Metals 17 12 (2007) 1936 (in Chin.)
36. Lu B., Wang J., Li H., Zhu H., and Jiao X. Effect of 0.1%Ce on intermetallic compounds at Sn-0.7Cu-0.5Ni/Cu interface. The Chinese Journal of Nonferrous Metals 17 3 (2007) 390 (in Chin.)