Reliability and Failure Analysis of Sn-Ag-Cu Solder Interconnections for PSGA Packages on Ni/Au Surface Finish

IEEE Transactions on Device and Materials Reliability

Volumn 4, Issue 1, 2004, Pages 5-10

  Ratchev, Petar ^a   Vandevelde, Bart ^a   De Wolf, Ingrid ^a  

^a IMEC   (Belgium)

Author keywords

Lead free; Ni Au surface finish; Sn Ag Cu solder interconnects

Indexed keywords

CRACK PROPAGATION; DEFORMATION; ELECTRONICS PACKAGING; INTERCONNECTION NETWORKS; INTERFACES (MATERIALS); METAL FINISHING; STRAIN;

SOLDER FATIGUE; SOLDER INTERCONNECTIONS; THERMOMECHANICAL STRAIN;

SOLDERING ALLOYS;

EID: 2342545433     PISSN: 15304388     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDMR.2003.822341     Document Type: Conference Paper

References (12)

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