Validation of a general fatigue life prediction methodology for Sn-Ag-Cu lead-free solder alloy interconnects

Journal of Electronic Packaging

Volumn 130, Issue 1, 2008, Pages 0110031-01100312

  Pierce, David M ^a   Sheppard, Sheri D ^a   Vianco, Paul T ^b   Regent, Jerome A ^b   Grazier, J Mark ^b  

^a Stanford University   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Electronic packaging; Fatigue prediction; Lead free solder

Indexed keywords

BALL GRID ARRAYS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; PLASTICITY; SOLDERED JOINTS; SOLDERING ALLOYS;

FATIGUE PREDICTION; LEAD-FREE SOLDER; SOLDER INTERCONNECTS; UNIFIED CREEP PLASTICITY DAMAGE (UCPD);

FATIGUE OF MATERIALS;

EID: 44449149327     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2837515     Document Type: Article

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