Evaluation of solder joint strengths under ball impact test

Microelectronics Reliability

Volumn 47, Issue 12, 2007, Pages 2179-2187

  Lai, Yi Shao ^a   Chang, Hsiao Chuan ^a   Yeh, Chang Lin ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

FORCE MEASUREMENT; IMPACT TESTING; INTERMETALLICS; SHEAR STRAIN; STRENGTH OF MATERIALS;

BALL IMPACT TEST (BIT); HIGH-SPEED SHEARING; PACKAGE-LEVEL MEASURES; SURFACE FINISHING;

SOLDERED JOINTS;

EID: 35648968080     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.11.015     Document Type: Article

References (26)

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