Correlation between package-level ball impact test and board-level drop test

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 1, Issue , 2005, Pages 270-275

  Yeh, Chang Lin ^a   Lai, Yi Shao ^a   Chang, Hsiao Chuan ^a   Chen, Tsan Hsien ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CORRELATION METHODS; IMPACT TESTING; INTEGRATED CIRCUIT TESTING; SOLDERED JOINTS; TIN ALLOYS;

DROP TESTING; PACKAGE-LEVEL BALL IMPACT TESTING;

CHIP SCALE PACKAGES;

EID: 33847253025     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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