Characterization of wafer level package for mobile phone application

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1398-1401

  Kim, J Y ^a   Kang, I S ^a   Park, M G ^a   Kim, J H ^a   Cho, S J ^a   Park, I S ^a   Chun, H S ^a  

^a Hyundai Electronics Industries   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC PROPERTIES; MECHANICAL TESTING; RANDOM ACCESS STORAGE; RELIABILITY; SILICON WAFERS; SOLDERED JOINTS; THERMAL CYCLING;

FOUR POINT TWISTING TEST; MECHANICAL SHOCK TEST; STATIC RANDOM ACCESS MEMORY; VARIABLE FREQUENCY VIBRATION TEST; WAFER LEVEL PACKAGE;

ELECTRONICS PACKAGING;

EID: 0034829039     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2001.928016     Document Type: Article

References (7)

1. CSPs for portable electronics
2. CSP SMT and solder joint reliability
3. Reliability of area array solder joints in bending
4. Reliability and failure analysis of CSP under bending cycling test
5. A proposal the assessing method of the CSP's mechanical reliability on board
6. Evaluation of reliability of μBGA solder joints through twisting and bending