Effect of thermal aging on high speed ball shear and pull tests of SnAgCu lead-free solder balls

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 463-470

  Song, Fubin ^a   Ricky Lee, S W ^a   Newman, Keith ^b   Reynolds, Heidi ^b   Clark, Stephen ^c   Sykes, Bob ^c  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b SUN MICROSYSTEMS   (United States)

^c DAGE Holdings Limited

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIONAL SAMPLES; BALL SHEAR; BALL-SHEAR TEST; DROP TESTING; ELECTRONIC PRODUCTS; HIGH SPEEDS; IMC THICKNESS; IMPACT VELOCITIES; JOINT RELIABILITY; LEAD-FREE SOLDER; PACKAGING TECHNOLOGIES; SOLDER BALL SHEAR; SOLDER JOINT RELIABILITY; SOLDER JOINTS; TEST EQUIPMENT; TEST METHODS; TEST SPECIMENS;

BRAZING; DROPS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; EQUIPMENT TESTING; FAILURE ANALYSIS; FLUID MECHANICS; FRACTURE; FRACTURE ENERGY; FRACTURE FIXATION; INTERMETALLICS; LEAD; QUALITY ASSURANCE; RELIABILITY; SOLDERED JOINTS; SOLDERING; SPEED; TECHNOLOGY; THERMAL AGING; WELDING;

TESTING;

EID: 50049126381     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469721     Document Type: Conference Paper

References (22)

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