Dynamic properties of solders and solder joints

Journal De Physique. IV : JP

Volumn 110, Issue , 2003, Pages 477-482

  Siviour, C R ^a   Williamson, D M ^a   Palmer, S J P ^a   Walley, S M ^a   Proud, W G ^a   Field, J E ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

GRAIN GROWTH; SHEAR STRENGTH; SOLDERED JOINTS; STRAIN RATE;

DYNAMIC PROPERTIES;

SOLDERING ALLOYS;

EID: 0242495771     PISSN: 11554339     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1051/jp4:20020739     Document Type: Conference Paper

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