A component level test method for evaluating the resistance of Pb-free BGA solder joints to brittle fracture under shock impact

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1522-1529

  Zhao, X J ^a   Caers, J F J M ^b   De Vries, J W C ^b   Wong, E H ^c   Rajoo, R ^c  

^a PHILIPS RESEARCH LABORATORIES   (Germany)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLE FRACTURE; ELECTROPLATED PRODUCTS; INTERFACES (MATERIALS); INTERMETALLICS; SHEAR DEFORMATION; SHOCK TESTING;

DROP TESTS; ELECTROPLATED FINISHES; INTERFACE STRENGTH; SHOCK IMPACT;

SOLDERED JOINTS;

EID: 35348848368     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373996     Document Type: Conference Paper

References (13)

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