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Volumn 2006, Issue , 2006, Pages 95-101

A comparative study of the failure mechanisms encountered in drop and large amplitude vibration tests

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE (MECHANICAL); FINITE ELEMENT METHOD; LOADS (FORCES); NATURAL FREQUENCIES; VIBRATIONS (MECHANICAL);

EID: 33845567101     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645631     Document Type: Conference Paper
Times cited : (35)

References (14)
  • 1
    • 33845571026 scopus 로고    scopus 로고
    • Board level drop test method of components for handheld electronic products
    • JESD22-B111
    • JESD22-B111, "Board level drop test method of components for handheld electronic products", JEDEC Solid State Technology Association, 2003, p. 16.
    • (2003) JEDEC Solid State Technology Association , pp. 16
  • 4
    • 33644921774 scopus 로고    scopus 로고
    • Reliability of lead-free interconnections under consecutive thermal and mechanical loadings
    • in print
    • T. T. Manila and J. K. Kivilahti, " Reliability of lead-free interconnections under consecutive thermal and mechanical loadings ", Journal of Electronic Materials, 35, 2, (in print).
    • Journal of Electronic Materials , vol.35 , Issue.2
    • Manila, T.T.1    Kivilahti, J.K.2
  • 5
    • 23244448289 scopus 로고    scopus 로고
    • Failure mechanisms of lead-free chip scale package interconnections under fast mechanical loading
    • T. T. Manila and J. K. Kivilahti, "Failure mechanisms of lead-free chip scale package interconnections under fast mechanical loading", Journal of Electronic Materials, 34, 7, (2005), pp. 969-976.
    • (2005) Journal of Electronic Materials , vol.34 , Issue.7 , pp. 969-976
    • Manila, T.T.1    Kivilahti, J.K.2
  • 8
    • 23244449165 scopus 로고    scopus 로고
    • Package miniaturization options and challenges for baseband IC's
    • Espoo, Finland, Sept. 21-24, 2003, IMAPS
    • K. Kujala and M. Kulojärvi, "Package miniaturization options and challenges for baseband IC's", The Proceeding of IMAPS Nordic Annual Conference, Espoo, Finland, Sept. 21-24, 2003, IMAPS, (2003), pp. 87-91.
    • (2003) The Proceeding of IMAPS Nordic Annual Conference , pp. 87-91
    • Kujala, K.1    Kulojärvi, M.2
  • 9
    • 33845565536 scopus 로고    scopus 로고
    • Experimental studies of board-level reliability of chip scale packages subjected to JEDEC drop test condition
    • in print
    • Y.-S. Lai, P.-F. Yang, and C.-L. Yeh "Experimental studies of board-level reliability of chip scale packages subjected to JEDEC drop test condition". Microelectronics Reliability, (2005), www.sciencedirect.com, (in print).
    • (2005) Microelectronics Reliability
    • Lai, Y.-S.1    Yang, P.-F.2    Yeh, C.-L.3
  • 10
    • 28444441992 scopus 로고    scopus 로고
    • Transient analysis of board-level drop response of lead-free chip-scale packages with experimental verifications
    • Singapore, Dec 8-10, 2004, IEEE/ED CPMT
    • C.-L. Yeh and Y.-S. Lai, "Transient analysis of board-level drop response of lead-free chip-scale packages with experimental verifications", The Proceedings of The 6th Electronics Packaging Technology Conference, Singapore, Dec 8-10, 2004, IEEE/ED CPMT, (2004), p. 695-700.
    • (2004) The Proceedings of the 6th Electronics Packaging Technology Conference , pp. 695-700
    • Yeh, C.-L.1    Lai, Y.-S.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.