Dynamics of board-level drop impact

Journal of Electronic Packaging

Volumn 127, Issue 3, 2005, Pages 200-207

  Wong, E H ^a  

^a UNIVERSITY OF SYDNEY   (Australia)

Author keywords

Drop Impact; Dynamics; Electronic Packaging; Finite Element

Indexed keywords

BEAMS AND GIRDERS; DROP FORMATION; DYNAMIC RESPONSE; FINITE ELEMENT METHOD; NATURAL FREQUENCIES; PLATES (STRUCTURAL COMPONENTS);

DROP IMPACT; ELECTRONIC PACKAGING; FINITE ELEMENT; TIME-INTEGRATION CODE;

DYNAMICS;

EID: 26844567665     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1938987     Document Type: Article

References (13)

1. Seah, S. K. W., et al., 2002, "Mechanical Response of PCBs in Portable Electronic Products During Drop Impact," Proc. 4th EPTC, Singapore, pp. 120-125.
2. Lim, C. T., et al., 2003, "Drop Impact Survey of Portable Electronic Products," Proc. 53rd ECTC.
3. Wong, E. H., et al., 2002, "Drop Impact Test - Mechanics and Physics of Failure," Proc. 4th EPTC, pp. 327-333.
4. Wong, E. H., et al., 2003, "Tackling Board Level Drop Impact Reliability of Electronic Interconnections," Interpack.
5. Wong, E. H., and Seah, S. K. W., 2003, "Fundamentals of Drop Impact," presented in JEDEC Working Group Meeting.
6. MIL Standard MIL-STD-883E, Method 2002.3, "Mechanical Shock."
7. IEC Standard IEC 60068-2-27, "Environmental Testing - Part 2: Tests, Test Ea and Guidance: Shock."
8. JEDEC Standard JESD22-B110, Subassembly Mechanical Shock.
9. Zienkiewicz, O. C., et al., 1991, The Finite Element Method, 4th Ed., Vol. 2, McGraw Hill, New York.
10. Bathe, K-J., 1996, Finite Element Procedures, Prentice-Hall.
11. Singiresu, S. R., 1995, Mechanical Vibration, 3rd Edition, Addition-Wesley.
12. Mindlin, R. D., 1946, "Dynamics of Package Cushioning," Bell Syst. Tech. J., pp. 424-426.
13. Suhir, E., 1988, "On a Paradoxical Phenomenon Related to Beams on Elastic Foundation: Could External Compliant Leads Reduce the Strength of a Surface-Mounted Device?," ASME J. Appl. Mech., 55, p. 818.