Stress-strain characteristics of tin-based solder alloys for drop-impact modeling

Journal of Electronic Materials

Volumn 37, Issue 6, 2008, Pages 829-836

  Wong, E H ^a   Selvanayagam, C S ^a   Seah, S K W ^a   Van Driel, W D ^b,c   Caers, J F J M ^c   Zhao, X J ^c   Owens, N ^d   Tan, L C ^d   Frear, D R ^d   Leoni, M ^d   Lai, Y S ^e   Yeh, C L ^e  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NXP SEMICONDUCTORS   (Netherlands)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

^d FREESCALE SEMICONDUCTOR INC   (United States)

^e ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Constitutive properties; Drop impact; Electronic packaging; Finite element modeling; Material characterization; Mechanical shock

Indexed keywords

CONSTITUTIVE PROPERTIES; DROP IMPACT; HOPKINSON PRESSURE; MATERIAL CHARACTERIZATION; MECHANICAL SHOCKS;

DROPS; ELECTRONICS PACKAGING; EUTECTICS; FINITE ELEMENT METHOD; PRESSURE MEASUREMENT; STRAIN RATE; STRESS ANALYSIS;

SOLDERING ALLOYS;

EID: 42449137840     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0403-x     Document Type: Article

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