Mechanical properties of SnPb and lead-free solders at high rates of strain

Journal of Physics D: Applied Physics

Volumn 38, Issue 22, 2005, Pages 4131-4139

  Siviour, C R ^a   Walley, S M ^a   Proud, W G ^a   Field, J E ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; LEAD COMPOUNDS; MOLECULAR STRUCTURE; QUENCHING; STRAIN RATE; TIN COMPOUNDS;

HOPKINSON PRESSURE BARS; LEAD FREE SOLDERS; PHASE STRUCTURE;

SOLDERING ALLOYS;

EID: 27844578669     PISSN: 00223727     EISSN: 13616463     Source Type: Journal    
DOI: 10.1088/0022-3727/38/22/018     Document Type: Article

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