Micro-impact test on lead-free BGA balls on Au/electrolytic Ni/Cu bond pad

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 467-471

  Ou, Shengquan ^a   Xu, Yuhuan ^a   Tu, K N ^a   Alam, M O ^b   Chan, Y C ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLE TRANSITION; INTERFACIAL FRACTURE; THERMAL AGING; WIRE-BONDS;

COPPER; ELECTROLYSIS; GOLD; IMPACT TESTING; NICKEL; SOLDERED JOINTS;

ELECTRONICS PACKAGING;

EID: 24644455360     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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2. Nishiura M, Nakayama A, Sakatani S, Kohara Y, Uenishi K, Kobayashi KF., "Mechanical strength and microstructure of BGA joints using lead-free solders,"Mater Trans., 43 (2002), pp.1802.
3. Tz-Cheng Chiu, Kejun Zeng, Roger Stierman and Darvin Edwards, Kazuaki Ano, "Effect of Thermal Aging on Board Level Drop Reliability for Pb-free BGA Packages,"The proceedings of the 54th ECTC, Las Vegas, NV, 2004, pp.1256.
4. Shoji T, Yamamoto K, Kajiwara R, Morita T, Sato K, Date M., Proceedings of the 16th JIEP Annual Meeting, 2002, pp.97.
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6. John M. Holt, editor, "Charpy Impact Test: Factors and Variables"ASTM STP 1072, Philadelphia, PA, (1990).
7. K. Zeng and K. N. Tu, "Six cases of reliability study of Pb-free solder joints in electronic packaging technology,"Mater. Sci. Eng., R., 38 (2002), pp. 55.
8. M. Date, T. Shoji, M. Fujiyoshi, K. Sato, and K. N. Tu, "Impact Reliability of Solder Joints,"The proceedings of the 54th ECTC, Las Vegas, NV, June 2004, pp. 668-674.
9. J. P. Schaffer, A. Saxena, S. D. Antolovich, T. H. Sanders, Jr., and S. B. Warner, "The Science and Design of Engineering Materials", 2rd Ed., WCB McGraw-Hill (1999), pp. 382.
10. M. O. Alam, Y. C. Chan, and K. N. Tu, "Effect of 0.5 wt.% Cu addition in the Sn-3.5%Ag solder on the interfacial reaction with Au/Ni metallizaion,"Chemistry of Materials, 15 (2003), pp.4340-4342.