Comparison of joint strength and fracture energy of lead-free solder balls in high speed ball shear/pull tests and their correlation with board level drop test

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 450-458

  Song, Fubin ^a   Ricky Lee, S W ^a   Newman, Keith ^b   Clark, Stephen ^c   Sykes, Bob ^c  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b SUN MICROSYSTEMS   (United States)

^c DAGE Holdings Limited

Author keywords

[No Author keywords available]

Indexed keywords

BALL SHEAR; CORRELATION MODELING; DROP TESTING; FRACTURE FORCE; HIGH SPEEDS; INTERMETALLIC COMPOUND; JOINT STRENGTH; LEAD-FREE SOLDER; PACKAGING TECHNOLOGIES; PAD SURFACE; SOLDER BALLS; SOLDER JOINT RELIABILITY; SOLDER JOINTS;

ARSENIC COMPOUNDS; BRAZING; CHLORINE COMPOUNDS; CORRELATION METHODS; DROPS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FLUID MECHANICS; FRACTURE; FRACTURE FIXATION; INTERMETALLICS; LEAD; METALS; QUALITY ASSURANCE; SAFETY FACTOR; SEMICONDUCTING INTERMETALLICS; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; SPEED; TECHNOLOGY; TESTING; THERMAL AGING; WELDING;

RELIABILITY;

EID: 50049098590     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469720     Document Type: Conference Paper

References (18)

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