Understanding and testing for drop impact failure

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART B, Issue , 2005, Pages 1089-1094

  Seah, S K W ^a   Wong, E H ^b   Ranjan, R ^b   Lim, C T ^a   Mai, Y W ^c  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

^c UNIVERSITY OF SYDNEY   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

DROP FORMATION; ELECTRONIC EQUIPMENT; MECHANICAL PROPERTIES; NATURAL FREQUENCIES; PRINTED CIRCUIT BOARDS; STRAIN CONTROL;

STRAIN AMPLITUDES; TIME-CONSUMING DROP IMPACT;

IMPACT TESTING;

EID: 32844468073     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73047     Document Type: Conference Paper

References (11)

1. JEDEC Standard JESD22-B111, Board Level Drop Test Method of Components for Handheld Electronic Products.
2. Dongji Xie, Minna Arra, Sammy Yi, and Dan Rooney, 2003, "Solder Joint Behavior of Area Array Packages in Board Level Drop for Handheld Devices," Proc ECTC 2003, pp 130-135.
3. Qiang Yu, Keiji Watanabe, Toshihiro Tsurusawa, Masaki Shiratori, Manabu Kakino, and Noriyuki Fujiwara, 2004, "The Examination of the Drop Impact Test Method, Proc ITherm 2004, pp 336-342.
4. Varghese J., and Dasgupta A., 2003, "Test Methodology for Impact Testing of Portable Electronic Products," ASME EEP Vol 3, pp 71-77.
5. Liping Zhu, and Walt Marcinkiewicz, 2004, "Drop Impact Reliability Analysis of CSP Packages at Board and Product System Levels Through Modeling Approaches," Proc ITherm 2004, pp 296-303.
6. Pradeep Lall, Dhananjay Panchagade, Yueli Liu, Wayne Johnson, and Jeff Suhling, 2004, "Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact," Proc ECTC 2004, pp 1296-1303.
7. J.G. Kim, and Y.K. Park, 2004, "Experimental Verification of Drop/Impact Simulation of a Cellular Phone," Expt. Mech., Vol 44, No 4, pp 375-380.
8. Tz-Cheng Chiu, Kejun Zeng, Roger Stierman, Darvin Edwards, and Kazuaki Ano, 2004, "Effect of Thermal Aging on Board Level Drop Reliability for Pb-free BGA packages," Proc ECTC 2004, pp 1256-1262.
9. Lim C.T., Wong E.H., Ang C.W., Tan LB., Tan V.B.C., and Shim V.P.W., 2004, "Drop Impact Study of Handheld Electronic Products," 5th International Symposium on Impact Engineering, UK, 2004.
10. Wong E.H., 2005, "Dynamics of Board Level Drop Impact" (To be published in Sept 2005 ASME JEP).
11. E.H. Wong, K.M. Lim, N. Lee, S. Seah, C. Koh, and J. Wang, 2002, "Drop Impact Test - Mechanics and Physics of Failure," Proc 4th Electronic Packaging Technology Conference (EPTC), 2002.