Board level drop impact - Fundamental and parametric analysis

Journal of Electronic Packaging

Volumn 127, Issue 4, 2005, Pages 496-502

  Wong, E H ^a   Mai, Y W ^a   Seah, S K W ^b  

^a UNIVERSITY OF SYDNEY   (Australia)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Drop impact; Electronic packaging; Finite element; Parametric studies

Indexed keywords

ACCELERATION; BEAM LEAD DEVICES; ELASTIC MODULI; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTERCONNECTION NETWORKS; SOLDERING ALLOYS;

DROP IMPACT; INERTIA LOADING; PARAMETRIC STUDIES; PCB FLEXING;

PRINTED CIRCUIT BOARDS;

EID: 29544437817     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2065747     Document Type: Article

References (17)

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