Board-level solder joint reliability of high performance computers under mechanical loading

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

Volumn , Issue , 2008, Pages

  Newman, Keith ^a  

^a SUN MICROSYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; BRAZING; BRITTLE FRACTURE; ELECTRONICS INDUSTRY; EXPERIMENTS; FRACTURE; FRACTURE FIXATION; HIGH PERFORMANCE LIQUID CHROMATOGRAPHY; LEAD; MICROELECTRONICS; SOLDERING ALLOYS; STRAIN RATE; STRESSES; SUPERCOMPUTERS; TESTING; WELDING; WIND EFFECTS;

ACCEPTANCE CRITERIA; COMPUTER PRODUCTS; ELECTRONIC ASSEMBLIES; END USES; FRACTURE STRENGTHS; HIGH STRAIN RATES; HIGH-PERFORMANCE COMPUTERS; IMPACT LOADINGS; INTERNATIONAL CONFERENCES; KEY PARAMETERS; MECHANICAL LOADINGS; MECHANICAL STRESSING; MICRO-SYSTEMS; MODELING APPROACHES; MULTI-PHYSICS SIMULATION; PB-FREE SOLDERS; POWER DISSIPATIONS; SOLDER JOINT RELIABILITY; SOLDER JOINTS; TEST METHODS; VOLUMETRIC DENSITY;

COMPUTER SYSTEMS;

EID: 49249121185     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2008.4525109     Document Type: Conference Paper

References (31)

1. IPC/JEDEC Standard IPC/JEDEC-9702, "Monotonic Bend Characterization of Board-Level Interconnects," June 2004.
2. IPC/JEDEC Standard IPC/JEDEC-9704, "Printed Wiring Board Strain Gage Test Guideline," June 2005.
3. C.F. Coombs (editor), Printed Circuits Handbook, McGraw-Hill, 6th Edition, 2007, pp. 59.1-59.35.
4. JEDEC Standard JESD22-B111, "Board Level Drop Test Method of Components for Handheld Electronic Products," July 2003.
5. IPC/JEDEC Standard IPC/JEDEC-9703, "Mechanical Shock Test Guidelines for Solder Joint Reliability," ballot draft.
6. JEDEC Standard JESD22-B110A, "Subassembly Mechanical Shock," November 2004.
7. K. Newman, "BGA Brittle Fracture - Alternative Solder Joint Integrity Test Methods," Proc. 55th Electronic Components & Technology Conference, Orlando, FL, June 2005, pp. 1194-1200.
8. F.B. Song, S.W.R. Lee, K. Newman, B. Sykes and S. Clark, "High Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed," Proc. 57th Electronic Components & Technology Conference, Reno, NV, June 2007, pp. 1504-1513.
9. F.B. Song, S.W.R. Lee, K. Newman, B. Sykes and S. Clark, "Brittle Failure Mechanism of SnAgCu and SnPb Solder Balls during High Speed Ball Shear and Cold Ball Pull Test," Proc. 57th Electronic Components & Technology Conference, Reno, NV, June 2007. pp. 364-372.
10. F.B. Song, S.W.R. Lee, S. Clark, B. Sykes and K. Newman, "Characterization of Failure Modes and Analysis of Joint Strength Using Various Conditions for High Speed Solder Ball Shear and Cold Ball Pull Tests," Proc. 16th EMPC, Oulu, Finland , June 2007, pp. 413-418.
11. F.B. Song, S.W.R. Lee, K. Newman, H. Reynolds, B. Sykes and S. Clark, "Effect of Thermal Aging on High Speed Ball Shear and Pull Tests of SnAgCu Lead-free Solder Balls," Proc. 9th Electronic Packaging Technology Conference, Singapore, December 2007, pp. 463-470.
12. F.B. Song, S.W.R. Lee, K. Newman, S. Clark and B. Sykes, "Comparison of Joint Strength and Fracture Energy of Lead-free Solder Balls in High Speed Ball Shear/Pull Tests and their Correlation with Board Level Drop Test," Proc. 9th Electronic Packaging Technology Conference, Singapore, December 2007, pp. 450-458.
13. JEDEC Standard JESD22-B117A, "Solder Ball Shear," October 2006.
14. JEDEC Standard JESD22-B115, "Solder Ball Pull," May 2007.
15. st International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March 2005.
16. S.K.W. Seah, E.H. Wong, Y.W. Mai, R. Rajoo and C.T. Lim, "High-Speed Bend Test Method and Failure Prediction for Drop Impact Reliability," Proc. 56th Electronic Components & Technology Conference, San Diego, CA, June 2006, pp. 1003-1008.
17. G. Long, T. Embree, M.l Mukadam, S. Parupalli and V. Vasudevan, "Lead Free Assembly Impacts on Laminate Material Properties and Pad Crater Failures," Proceedings of APEX 2007, Los Angeles, February 2007.
18. M. Ahmad, D. Sink, J. Burlingame, "Methodology to Characterize Pad Cratering under BGA Pads in Printed Circuit Boards," Proc. 13th Pan Pacific Microelectronics Symposium, Kauai, HI, January 2008, pp. 182-188.
19. JEITA Standard EIAJ ET-7407, Annex 11 and 12, "Peel Test Method for Test Board Land," December 1999.
20. D. Xie, J. Wang, H. Yu, D. Lau and D. Shangguan, "Impact Performance of Microvia and Buildup Layer Materials and its Contribution to Drop Test Failures," Proc. 57th Electronic Components & Technology Conference, Reno, NV, June 2007. pp. 391-399.
21. S. Park, C. Shah, J. Kwak, C. Jang and J. Pitarresi, "Transient Dynamic Simulation and Full-Field Test Validation for a Slim-CB of Mobile Phone under Drop/Impact," Proc. 57th Electronic Components & Technology Conference, Reno, NV, June 2007. pp. 914-923.
22. P. Lall, D. Panchagade, D. Iyengar, S. Shantaram, J. Suhling, H. Schrier, "High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics," Proc. 57th Electronic Components & Technology Conference, Reno, NV, June 2007. pp. 924-939.
23. Telcordia Standard GR-63-CORE, "NEBS Requirements: Physical Protection Environmental Test Methods," Handling Test Methods, March 2006.
24. IEC Standard 68-2-31, "Basic environmental testing procedures," 1969.
25. IEC Standard 68-2-31 Amendment 1, "Basic environmental testing procedures," 1982.
26. R. Dudek, W. Faust, S. Wiese, M. Röllig and B. Michel, "Low-cycle Fatigue of Ag-Based Solders Dependent on Alloying Composition and Thermal Cycle Conditions," Proc. 9th Electronic Packaging Technology Conference, Singapore, December 2007.
27. E. Kaulfersch, S. Rzepka, V. Ganeshan, A. Mueller and B. Michel, "Dynamic Mechanical Behavior of SnAgCu BGA Solder Joints Determined by Fast Shear Tests and FEM Simulations," Proceedings of EuroSIME 2007, London, April 2007, pp. 172-176.
28. th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, June 2006, pp. 861-868.
29. E.H. Wong, "Dynamics of Board-Level Drop Impact", ASME Journal of Electronic Packaging, Vol. 127, September 2005, pp. 200-207.
30. A. Syed, T.S. Kim, Y.M. Cho, C.W. Kim and M.Y. Yoo, "Alloying Effect of Ni, Co, and Sb in SAC Solder for Improved Drop Performance of Chip Scale Packages with Cu OSP Pad Finish," Proc. 56th Electronic Components & Technology Conference, San Diego, CA, June 2006, pp. 404-411.
31. G. Henshall, M. Roesch, K. Troxel, H. Holder, J. Miremadi, "Manufacturability and Reliability Impacts of Alternate Pb-Free BGA Ball Alloys," Hewlett-Packard publication, June 2007, pp. 14-20.