Empirical correlation between package-level ball impact test and board-level drop reliability

Microelectronics Reliability

Volumn 47, Issue 7, 2007, Pages 1127-1134

  Yeh, Chang Lin ^a   Lai, Yi Shao ^a   Chang, Hsiao Chuan ^a   Chen, Tsan Hsien ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CORRELATION METHODS; ELECTRONICS PACKAGING; SOLDERED JOINTS; TIN ALLOYS;

BALL IMPACT TESTS; BOARD LEVEL DROP TESTS; PACKAGE LEVEL BALL IMPACT TESTS;

RELIABILITY ANALYSIS;

EID: 34249780105     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.07.093     Document Type: Article

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