Underfilling fine pitch BGAs

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 24, Issue 4, 2001, Pages 293-299

  Peng, Haiwei ^b   Johnson, R Wayne ^a,b   Flowers, George T ^b   Ricketts, Abbey Gayle ^b   Yeager, Erin K ^c   Konarski, Mark M ^a,c   Torres Filho, Afranio ^c   Crane, Lawrence ^a,c  

^a IEEE

^b AUBURN UNIVERSITY   (United States)

^c Loctite Corp   (United States)

Author keywords

Fine pitch BGAs; Rework; Underfill

Indexed keywords

FLIP CHIP DEVICES; PRINTED CIRCUIT BOARDS; SOLDERING; THERMAL CYCLING;

SUBSTRATE FLEXING TESTS;

CHIP SCALE PACKAGES;

EID: 0035493808     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.980038     Document Type: Article

References (6)

1. The ultra CSP™ wafer scale package
2. Reworkable underfill materials for improved manufacturability and reliability of CSP assemblies
3. Underfilling BGA and CSP for harsh environment deployment
4. Solving the ENIG black pad problem: An ITRI report on round 2
5. Manufacturability issues in flip chip on laminate assembly
6. CSP underfill, processing and reliability