Fatigue strength of BGA type solder joints between package and printed wiring board of portable device

JSME International Journal, Series A: Solid Mechanics and Material Engineering

Volumn 49, Issue 2, 2006, Pages 220-228

  Nagano, Kohta ^a   Yaguchi, Akihiro ^a   Terasaki, Takeshi ^a   Yamamoto, Kenichi ^b  

^a HITACHI LTD   (Japan)

^b RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

Chip scale package; Fatigue; Impact strength; Pb free solder alloy; Reliability

Indexed keywords

CHIP SCALE PACKAGES; CRACK INITIATION; CRACK PROPAGATION; ELASTICITY; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; PLASTICITY; PRINTED CIRCUIT BOARDS; STRAIN; STRENGTH OF MATERIALS;

CYCLIC BENDING; CYCLIC IMPACT BENDING TESTS; FREE SOLDER ALLOY; HEAT CYCLING; IMPACT STRENGTH;

SOLDERED JOINTS;

CHIP SCALE PACKAGES; CRACK INITIATION; CRACK PROPAGATION; ELASTICITY; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; PLASTICITY; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; STRAIN; STRENGTH OF MATERIALS;

EID: 33750309137     PISSN: 13447912     EISSN: 13475363     Source Type: Journal    
DOI: 10.1299/jsmea.49.220     Document Type: Article

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