High-speed solder ball shear and pull tests vs. board level mechanical drop tests: Correlation of failure mode and loading speed

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1504-1513

  Song, Fubin ^a   Lee, S W Ricky ^a   Newman, Keith ^b   Sykes, Bob ^c   Clark, Stephen ^c  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b SUN MICROSYSTEMS   (United States)

^c DAGE Holdings Limited

Author keywords

[No Author keywords available]

Indexed keywords

BOARD LEVEL DROP TESTING (BLDT); MECHANICAL DROP TESTS; MICROSCOPIC ANALYSIS; SURFACE FINISH;

FRACTURE MECHANICS; MECHANICAL TESTING; METAL FINISHING; PARAMETER ESTIMATION; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS;

ELECTRONICS PACKAGING;

EID: 35348882599     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373994     Document Type: Conference Paper

References (16)

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