Life prediction and damage equivalency for shock survivability of electronic components

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 804-816

  Lall, Pradeep ^a   Panchagade, Dhananjay ^a   Iyengar, Deepti ^a   Suhling, Jeff ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

Ball grid arrays; Drop impact; Life prediction; Reliability; Shock; Vibration

Indexed keywords

BALL GRID ARRAYS; DROP-IMPACT; ELECTRONIC BOARDS; LIFE-PREDICTION; SHOCK; WAVELET DECOMPOSITION;

DATA ACQUISITION; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; MODAL ANALYSIS; VIBRATIONS (MECHANICAL);

ELECTRONIC EQUIPMENT;

EID: 33845583726     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645430     Document Type: Conference Paper

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