Reliability Evaluation of Solder Joints in Ball-Grid-Array-Type Packages by Impact Bending Test

Journal of Japan Institute of Electronics Packaging

Volumn 6, Issue 4, 2003, Pages 314-321

  Yaguchi, Akihiro ^a   Yamada, Munehiro ^b   Yamamoto, Kenichi ^b  

^a HITACHI LTD   (Japan)

^b RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

Ball Grid Array; Impact Bending; PWB; Reliability; Solder Bump Joints; Surface Strain

Indexed keywords

EID: 85009638097     PISSN: 13439677     EISSN: 1884121x     Source Type: Journal    
DOI: 10.5104/jiep.6.314     Document Type: Article

References (0)