A study of crack propagation in Pb-free solder joints under drop impact

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1166-1172

  Caers, J F J M ^a   Wong, E H ^b,c   Seah, S K W ^c   Zhao, X J ^a   Selvanayagam, C S ^c   Van Driel, W D ^d   Owens, N ^e   Leoni, M ^e   Tan, L C ^e   Eu, P L ^e   Lai, Yi Shao ^f   Yeh, Chang Lin ^f  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^c INSTITUTE OF MICROELECTRONICS   (Singapore)

^d NXP SEMICONDUCTORS   (Netherlands)

^e Freescale   (Singapore)

^f ASE Inc

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (FORMING); BRAZING; COMPUTER NETWORKS; CRACK DETECTION; CRACKING (CHEMICAL); CRACKS; DROPS; ELECTRIC CURRENTS; FAILURE ANALYSIS; FLUID MECHANICS; FORMING; LEAD; LEAD ALLOYS; METALLIC COMPOUNDS; QUALITY ASSURANCE; SAFETY FACTOR; WELDING;

DROP IMPACT; PB-FREE; PB-FREE SOLDERS;

CRACK PROPAGATION;

EID: 51349132835     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550123     Document Type: Conference Paper

References (10)

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3. Wong E.H. et al, "Recent Advances in Drop-Impact Reliability", Proc. EuroSimE 2008, Freiburg, Germany, 20-23 April.
4. JEDEC Standard JESD22-B111 (2003), "Board level drop test method of components for handheld electronic products".
5. th ECTC, Lake Buena Vista, F1, May 31-June 3, 2005, pp1194-1201.
6. th ECTC, San Diego, CA, May 30-June 3, 2006, pp1003-1007.
7. Wong E.H. et al, "Drop Impact Test - Mechanics and Physics of Failure", Proc 4th Electronic Packaging Technology Conference, 2002, pp. 327-333.
8. Seah S.K.W., et al, "Understanding and Testing for Drop Impact Failure," Proc ASME InterPACK '05, 2005, IPACK2005-73047, pp 1-6.
9. Date M., et al, "Impact reliability of solder joints", Proc. 54 th ECTC Conf, 2004, Las Vegas, NV, June 1-4 2004, pp668-674.
10. th ECTC Conf., 2004, Las Vegas, NV, June 1-4, pp 1304-1309.