Micro impact characterisation of solder joint for drop impact application

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 64-71

  Wong, E H ^a,b   Mai, Y W ^b   Rajoo, R ^a   Tsai, K T ^c   Liu, F ^c   Seah, S K W ^a   Yeh, C L ^d  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b UNIVERSITY OF SYDNEY   (Australia)

^c INSTRON   (United Kingdom)

^d ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AGING CONDITIONS; CYCLIC BENDING TESTS; QUALITY ASSURANCE TESTS;

COMPUTER SIMULATION; IMPACT RESISTANCE; IMPACT TESTING; INSPECTION; MATHEMATICAL MODELS; SHEARING;

SOLDERED JOINTS;

EID: 33845571954     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645627     Document Type: Conference Paper

References (14)

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