Test methodology for impact testing of portable electronic products

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 3, Issue , 2003, Pages 71-77

  Varghese, J ^a   Dasgupta, A ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

Drop testing; Electronic Packaging; Impact testing; Interconnect damage

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; DATA REDUCTION; DURABILITY; DYNAMIC LOADS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; IMPACT TESTING; STRAIN; STRAIN RATE;

DROP TESTING; INTERCONNECT DAMAGES;

ELECTRONIC EQUIPMENT;

EID: 1942504825     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-41844     Document Type: Conference Paper

References (10)

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9. Varghese, J., Dasgupta, A.; 2003, "Test Tailoring Methodology for Impact Testing of Portable Electronic Products", IMAC-XXI Conference on Structural Dynamics, Kissimmee, Florida.
10. Shi, X.Q., Pang, H.J., Zhou, W., and Wang, Z.P., 1999, "Temperature and Strain Rate Effect on Mechanical Properties of 63Sn/37Pb Solder Alloy," Advances in Electronic Packaging, ASME, 26-1, pp 551-557.