Dynamic behavior of electronics package and impact reliability of BGA solder joints

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 953-960

  Yu, Qiang ^a   Kikuchi, Hironobu ^a   Ikeda, Shinya ^a   Shiratori, Masaki ^a   Kakino, Manabu ^b   Fujiwara, Noriyuki ^b  

^a YOKOHAMA NATIONAL UNIVERSITY   (Japan)

^b PANASONIC CORPORATION   (Japan)

Author keywords

BGA Solder Joints; Drop impact induced crack; Dynamic Analysis; Repetitive drop test; Transient Response Analysis

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; VIBRATIONS (MECHANICAL); YIELD STRESS;

BALL GRID ARRAYS (BGA);

SOLDERED JOINTS;

EID: 0036459764     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Liping Zhu (Elicsson, Inc.) "Submodeling Technique for BGA Reliability Analysis of CSP Packaging Subjected to an Impact Loading" Proceedings of IPACK'01 IPACK2001-15873.
2. Jason Wu, Guoshu Song, Chao-pin Yeh, Karl Wyatt (Motrola, Inc.) "Drop/Impact Simulation and Test Validation of Telecommunication Products" Proceedings of Itherm'98 pp.330-pp.336.
3. Qiang Yu, Masaki Shiratori, Yoichi Oshima (Yokohama National University) "A Study of The Effects of BGA Solder Geometry On Fatigue Life And Reliability Assessment" Proceedings of Itherm'98 pp.229-235.
4. Qiang Yu, Shinya Ikeda, Hironobu Kikuchi, Masaki Shiratori (Yokohama National University) "Deformation of Substrate and Reliability Estimation for Solder Joints in The Falling and impact on Solder Joints" MES2001, JIEP pp.435-pp.438.
5. Qiang Yu, Masaki Shiratori, Shinya Ikeda (Yokohama National University) "The Dynamic Characteristics of Impact Strength for Solder Joints of BGA" Symposium on Microjoining and Assembly Technology in Electronics February 1-2, 2001, Yokohama, JWS, pp.69-pp.74.