High-speed bend test method and failure prediction for drop impact reliability

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1003-1008

  Seah, S K W ^a   Wong, E H ^a   Mai, Y W ^b   Rajoo, R ^a   Lim, C T ^c  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b UNIVERSITY OF SYDNEY   (Australia)

^c NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DROP IMPACT RELIABILITY; HIGH SPEED BEND TESTS; IMPACT FAILURE; STRAIN AMPLITUDES;

BENDING STRENGTH; FAILURE (MECHANICAL); IMPACT TESTING; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; RELIABILITY THEORY; SOLDERED JOINTS;

BENDING (DEFORMATION);

EID: 33845570169     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645776     Document Type: Conference Paper

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