Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages

Soldering and Surface Mount Technology

Volumn 14, Issue 3, 2002, Pages

  Shiau, L C ^a   Ho, C E ^a   Kao, C R ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

Ball grid array; Intermetallics; Lead free soldering; Surface finishing

Indexed keywords

INTERFACES (MATERIALS); INTERMETALLICS; METAL FINISHING; MICROSTRUCTURE; SHEAR STRENGTH; SOLDERING ALLOYS; SURFACE REACTIONS; TIN ALLOYS;

LEAD-FREE SOLDERS;

ELECTRONICS PACKAGING;

EID: 18644381608     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910210444692     Document Type: Conference Paper

References (9)

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