Plasma reflow bumping of Sn-3.5 Ag solder for flux-free flip chip package application

IEEE Transactions on Advanced Packaging

Volumn 27, Issue 1, 2004, Pages 90-96

  Hong, Soon Min ^a   Kang, Choon Sik ^b   Jung, Jae Pil ^c  

^a SAMSUNG Electronics   (South Korea)

^b Seoul National University   (South Korea)

^c University of Seoul   (South Korea)

Author keywords

Bump; Flip chip; Flux free; Intermetallic compound; Joint strength; Microstructure; Pb free solder; Plasma; Reflow

Indexed keywords

BONDING; FLIP CHIP DEVICES; INTERFACES (MATERIALS); LASER APPLICATIONS; PLASMA FLOW; SHEAR STRENGTH; SILVER ALLOYS; SOLDERING ALLOYS;

FLUX FREE FLIP CHIP PACKAGE; PLASMA REFLOW BUMPING;

ELECTRONICS PACKAGING;

EID: 2442560367     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.821079     Document Type: Article

References (25)

1. K. F. Harsh, R. S. Irwin, and Y. C. Lee, "Study on micro-scale limits of solder self-assembly for MEMS," in Proc. IEEE Electron. Comp. Technol. Conf., 2000, pp. 1690-1695.
2. M. Bixenaman and E. Miller, "Circuit corrosion," in Proc. IEEE CPMT 5th Int. Joint Symp. Microelectron. Packag., Seoul, Korea, 2000, pp. 43-55.
3. B. Ellis, "Environmental issues in electronics manufacturing Ariview," Circuit World, vol. 26, no. 2, pp. 17-21, 2000.
4. A. Mistry, J. Czarnowski, C. Beddingfield, Q. Tan, J. Guajardo, and K. Rhyner, "Performane of evaporated and plated bumps on organic substrates," in Proc. IEEE-CPMT Symp., 1998, pp. 1-7.
5. E. K. Yung and I. Turlik, "Electroplated Solder Joints for Flip-Chip Applications," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 14, pp. 549-559, Sept. 1991.
6. J. Kloeser, K. Heignricht, E. Jung, L. Lauter, A. Ostmann, R. Aschenbrenner, and H. Reichl, "Low cost bumping by stencil printing: process qualification for 200 μm pitch," Micron. Rel., vol. 40, pp. 497-505, 2000.
7. T. Ogashiwa, T. Arikawa, A. Inoue, and T. Masumoto, "Direct solder bump formation technique on Al pad and its high reliability," Jpn. J. Appl. Phys., vol. 31, pp. 761-767, 1992.
8. K. J. Wolter, T.Th. Zerna, R. Deltschew, and H. Neumann, "Plasma treatment process for fluxless reflow soldering," in Proc. IEEE ETCT Conf., 2001, pp. 1295-1298.
9. N. Koopman, S. Bobbio, S. Nangalia, J. Bousaba, and B. Piekarski, "Fluxless soldering in air and nitrogen," in Proc. IEEE Electron. Comp. Technol. Conf., 1993, pp. 595-605.
10. H. Matsuki, H. Matsui, and E. Watanabe, "Fluxless bump reflow using carboxylic acid," in Proc. Int. Symp. Adv. Packag. Mater., 2001, pp. 135-139.
11. F. Masahiko, M. Tsugunori, D. Kazuhide, and N. Hiroshi, "Flux free flip chip attach technology for BGA/CSP packages," in Proc. IEEE Electron. Comp. Technol. Conf., 1999, pp. 408-414.
12. C. B. Park, S. M. Hong, J. P. Jung, C. S. Kang, and Y. E. Shin, "A study on the fluxless soldering of Si-wafer/glass substrate using Sn-3.5wt%Ag and Sn-37wt%Pb solder," Mater. Trans., vol. 42, no. 5, pp. 820-824, 2001.
13. G. Takyi, "Plasma treatment to eliminate the environmental concerns associated with solvent cleaning, flux, and flux application system," Ph.D. dissertation, Dept. of Aeronautical, Mech. Manufact. Eng., University of Salford, Salford, U.K., 1998.
14. 2 - A flexible manufacturing tool for three-dimensional sensor and microsystem packages," in Proc. IEEE-CPMT Conf., Berlin, Germany, 1998, pp. 70-75.
15. C. Beddingfield and L. M. Higgins, "The effects of flux materials on the moisture sensitivity and reliability of flip-chip-on-board assemblies," IEEE Trans. Comp., Packag., Manufact. Technol. C, vol. 21, pp. 189-195, Apr. 1998.
16. J. H. Lau, Ed., Flip Chip Technologies. New York: McGraw-Hill, 1995, pp. 83-121.
17. J. Y. Park, C. W. Yang, J. S. Ha, C. U. Kim, E. J. Kwon, S. B. Jung, and C. S. Kang, "Investigation of interfacial reaction between sn-ag eutectic solder and Au/Ni/Cu/Ti thin film metallization," J. Electron. Mater., vol. 30, no. 9, pp. 1165-1170, 2001.
18. K. Yokomine, N. Shimizu, Y. Miyamoto, Y. Iwata, D. Love, and K. Newman, "Development of electroless Ni/Au plated build-up flip chip package with highly reliable solder joints," in Proc. IEEE Electron. Comp. Technol. Conf., 2001, pp. 1371-1379.
19. C. Zhang, J. K. Shang, and P. Liu, "Intermetallic microstructure and mechanical fatigue behavior of Sn63Pb37 on electroplated Cu and Ni," in Proc. IEEE Electron. Comp. Technol. Conf., 2000, pp. 138-144.
20. 2 plasma to melt indium bump," M.S. thesis, Korea Advanced Institute of Science and Technology (KAIST), Seoul, Korea, 1997.
21. H. Masahiko, M. Tsugunori, A. Hideo, and T. Kasuhide, Korean Patent 10-2000-7 005 349, 2000.
22. R. J. Wassink, Soldering in Electronics. Ary, Scotland: Electrochemical Publ., 1989, pp. 620-622.
23. A.-A. H. Mohamed, R. Block, and K. H. Schoenbach, "Direct current discharges in atmospheric air," in Proc. Pulsed Power Plasma Sci. Conf., 2001, p. 384.
24. E. S. Paller, J. E. Scharer, R. Cao, and K. E. Kelly, "Air constituent plasmas produced by a radiofrequency plasma source," in Proc. Pulsed Power Plasma Sci. Conf., 2001, p. 393.
25. M. Okumoto, H. H. Kim, K. Takashima, S. Katsura, and A. Mizuno, "Reactivity of methane in nonthermal plasma in the presence of oxygen and inert gases at atmospheric pressure," IEEE Trans. Ind. Applicat., vol. 27, pp. 1618-1624, Nov./Dec. 2001.