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Acta Materialia

Volumn 54, Issue 1, 2006, Pages 247-253

Sn-0.7 wt.%Cu/Ni interfacial reactions at 250 °c

(2) Wang, Chao Hong a Chen, Sinn Wen a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

Detached layer; Interfacial reaction; Sn Cu; Solder

Indexed keywords

INTERFACES (MATERIALS); MICROSTRUCTURE; PHASE TRANSITIONS; SOLDERING ALLOYS; SURFACE CHEMISTRY; SURFACE REACTIONS; THERMAL EFFECTS;

DETACHED LAYERS; INTERFACIAL REACTIONS; SN-CU; SOLDER;

TIN ALLOYS;

EID: 27744561345 PISSN: 13596454 EISSN: None Source Type: Journal
DOI: 10.1016/j.actamat.2005.09.006 Document Type: Article

Times cited : (129)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.