Reactive isothermal solidification in the Ni-Sn system

Acta Materialia

Volumn 46, Issue 14, 1998, Pages 4917-4923

  Gur, D ^a   Bamberger, M ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; BINARY ALLOYS; CRYSTAL MICROSTRUCTURE; DIFFUSION IN SOLIDS; GRAIN BOUNDARIES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; HEAT TREATMENT; MORPHOLOGY; PHASE INTERFACES; REACTION KINETICS; SOLIDIFICATION;

MICROSTRUCTURAL TRANSITION ZONE (MTZ); REACTIVE ISOTHERMAL SOLIDIFICATION;

NICKEL ALLOYS;

EID: 0032158227     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(98)00192-X     Document Type: Article

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