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Volumn 17, Issue 11, 2002, Pages 2757-2760
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Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages
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Author keywords
[No Author keywords available]
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Indexed keywords
DIFFUSION IN SOLIDS;
DISSOLUTION;
ELECTRONICS PACKAGING;
EUTECTICS;
INTERFACES (MATERIALS);
METALLIZING;
SOLDERING ALLOYS;
TERNARY SYSTEMS;
THERMODYNAMIC STABILITY;
MOLTEN SOLDER;
REFLOW PROCESS;
UNDER BUMP METALLIZATION;
FLIP CHIP DEVICES;
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EID: 0036864459
PISSN: 08842914
EISSN: None
Source Type: Journal
DOI: 10.1557/JMR.2002.0397 Document Type: Article |
Times cited : (34)
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References (16)
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