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Volumn 17, Issue 11, 2002, Pages 2757-2760

Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION IN SOLIDS; DISSOLUTION; ELECTRONICS PACKAGING; EUTECTICS; INTERFACES (MATERIALS); METALLIZING; SOLDERING ALLOYS; TERNARY SYSTEMS; THERMODYNAMIC STABILITY;

EID: 0036864459     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2002.0397     Document Type: Article
Times cited : (34)

References (16)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.