Volume effect on the soldering reaction between SnAgCu solders and Ni

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 2005, Issue , 2005, Pages 39-44

  Ho, C E ^a   Lin, Y W ^a   Yang, S C ^a   Kao, C R ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CONCENTRATION (PROCESS); COPPER; NICKEL; SOLDERED JOINTS; SOLDERING; TIN ALLOYS;

ARRAY-ARRAY PACKAGES; LIQUID-SOLID REACTIONS; SOLDER VOLUME EFFECT; SOLDERING REACTION;

SOLDERING ALLOYS;

EID: 33746530002     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2005.1432042     Document Type: Conference Paper

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