Interfacial reactions between Sn-0.4Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction

Journal of Alloys and Compounds

Volumn 396, Issue 1-2, 2005, Pages 122-127

  Yoon, Jeong Won ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Electroless nickel immersion gold (ENIG); Ni Sn P layer; P rich Ni layer; Pb free solder; Sn Cu Solder

Indexed keywords

ELECTROLESS PLATING; ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); MORPHOLOGY; NICKEL ALLOYS; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

ELECTROLESS NICKEL IMMERSION GOLD (ENIG) PLATING; NI-SN-P LAYERS; PB FREE SOLDERS; SN-CU SOLDERS;

SOLDERING ALLOYS;

EID: 18844382672     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2004.12.009     Document Type: Article

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