Transmission electron microscopy of interfaces in joints between Pb-free solders and electroless Ni-P

Materials Transactions

Volumn 44, Issue 7, 2003, Pages 1438-1447

  Torazawa, Naoki ^a   Arai, Shigeo ^a   Takase, Yoshihisa ^b   Sasaki, Katsuhiro ^a   Saka, Hiroyasu ^a  

^a NAGOYA UNIVERSITY   (Japan)

^b MECC Ltd   (Japan)

Author keywords

Electroless nickel phosphor; Focused ion beam; Fracture; Semiconductor package; Strength; Thermal cycling; Tin silver solder; Tin silver copper solder; Tin silver copper bismuth solder; Transmission electron microscopy; Void

Indexed keywords

DENSITY (SPECIFIC GRAVITY); ELECTROLESS PLATING; ELECTRON DIFFRACTION; ENERGY DISPERSIVE SPECTROSCOPY; FRACTURE; INTERFACES (MATERIALS); METALLIZING; MICROSTRUCTURE; NICKEL; SOLDERING; THERMAL CYCLING; TRANSMISSION ELECTRON MICROSCOPY;

BUMP METALLIZATION; COLUMNAR VOIDS; LEAD FREE SOLDERS;

TIN ALLOYS;

EID: 0041781633     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.44.1438     Document Type: Article

References (7)

1. K. Suganuma, et al.: Materia Japan 38 (1999) 919-974.
2. J.-H. Lee, D.-J. Pak, J.-N. Heo, Y.-H. Lee, D.-H. Shin and Y.-S. Kim: Scr. Mater. 42, (2000) 827-831.
3. J. W. Jang, P. G. Kim, K. N. Tu, D. R. Frear and R. Thompson: J. Appl. Phys. 85 (1999) 8456-8463.
4. H. Matsuki, H. Ibuka and H. Saka: J. Japan Inst. Metals 64 (2000) 213-217.
5. N. Torazawa, S. Arai, K. Shimomura, Y. Takase and H. Saka: J. Japan Inst. Metals 66 (2002) 47-52.
6. H. Matsuki, H. Ibuka and H. Saka: Sci. Technol. Advanced Materi. 3 (2002) 261-270.
7. Y. Kariya, K. Nakamura, Y. Tanaka and M. Otsuka: Proc. 6th Symp. on Microjoining and Assembly Technology in Electronics, (Japan Welding Society, Tokyo 2000) pp. 217-222.