Intermetallic growth on PWBs soldered with Sn3.8Ag0.7Cu

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1226-1231

  Zheng, Y ^a   Hillman, C ^a   McCluskey, P ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERMETALLIC GROWTH;

INTERFACES (MATERIALS); JOINTS (STRUCTURAL COMPONENTS); MICROSTRUCTURE; SHEAR STRENGTH; SOLDERING; TINNING;

INTERMETALLICS;

EID: 0036287043     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2002.1008263     Document Type: Article

References (17)

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5. Microstructure and strength of interface between Sn-Ag eutectic solder and Cu
6. Microstructure evolution of eutectic Sn-Ag solder joints
7. Intermetallic phase formation and growth kinetics at the interface between molten solder and ni-containing under bump metallization
8. Interactions between solder and metallization during long-term aging of advanced microelectronic packages
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10. Lead free interfacial structures and their relationship to Au plating
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14. The kinetics of ternary intermetallic alloys in Pb-Sn and Cu-Ag-Sn Pb free electronic joints
15. Solid-state intermetallic compound growth between copper and high temperature, tin-rich solders-Part 1: Experimental analysis
16. Constitutive behavior of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip joints
17. Brittleness interfacial fracture of PBGA packages soldered on electroless nickel/immersion gold