Inhibiting the formation of (Au1-xNix)Sn4 and reducing the consumption of Ni metallization in solder joints

Journal of Electronic Materials

Volumn 31, Issue 11, 2002, Pages 1264-1269

  Ho, C E ^a   Shiau, L C ^a   Kao, C R ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

Au Ni Cu metallization; Intermetallic; Solder; Solder joint

Indexed keywords

AGING OF MATERIALS; COPPER ALLOYS; ELECTROPLATING; GOLD ALLOYS; INTERFACIAL ENERGY; INTERMETALLICS; LEAD ALLOYS; METALLIZING; NICKEL;

COPPER-DOPED SOLDER JOINT; INTERFACIAL REACTION; NICKEL METALLIZATION; SOLDER BALL;

SOLDERED JOINTS;

EID: 0036867582     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0019-5     Document Type: Article

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