Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology

Journal of Applied Physics

Volumn 85, Issue 12, 1999, Pages 8456-8463

  Jang, J W ^a   Kim, P G ^a   Tu, K N ^a   Frear, D R ^b   Thompson, P ^c  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b SEMATECH   (United States)

^c MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS FILMS; COMPOSITION EFFECTS; CRYSTALLIZATION; ENERGY DISPERSIVE SPECTROSCOPY; FILM GROWTH; FLIP CHIP DEVICES; MULTILAYERS; NICKEL; PHOSPHORUS; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY;

ELECTRON PROBE MICROANALYZERS; LOW COST FLIP CHIP TECHNOLOGY (LCFCT); SOLDER REACTION-ASSISTED CRYSTALLIZATION; UNDER BUMP METALLIZATION (UBM);

SEMICONDUCTING FILMS;

EID: 0032614004     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.370627     Document Type: Article

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