Microstructures of phased-in Cr-Cu/Cu/Au bump-limiting metallization and its soldering behavior with high Pb content and eutectic PbSn solders

Applied Physics Letters

Volumn 71, Issue 20, 1997, Pages 2946-2948

  Pan, G Z ^a   Liu, Ann A ^a   Kim, H K ^a   Tu, K N ^a   Totta, Paul A ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001514053     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.120224     Document Type: Article

References (11)

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