Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering

Journal of Electronic Materials

Volumn 28, Issue 11, 1999, Pages 1231-1237

  Ho, C E ^a   Chen, Y M ^a   Kao, C R ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

EUTECTICS; GOLD ALLOYS; GRAIN SIZE AND SHAPE; INTERFACES (MATERIALS); LEAD ALLOYS; LIQUID METALS; NICKEL ALLOYS; REACTION KINETICS; SOLDERING ALLOYS;

BALL GRID ARRAYS (BGA) PACKAGES; REFLOW SOLDERING; SOLDER-BALLS;

ELECTRONICS PACKAGING;

EID: 0033221504     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-999-0162-3     Document Type: Article

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