A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy

Journal of Electronic Materials

Volumn 32, Issue 6, 2003, Pages 548-557

  Jeon, Young Doo ^a   Nieland, Sabine ^b   Ostmann, Andreas ^b   Reichl, Herbert ^b   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b FRAUNHOFER IZM   (Germany)

Author keywords

Electroless Ni; Pb free solder; SnAgCu; UBM

Indexed keywords

AGING OF MATERIALS; ELECTROLESS PLATING; GROWTH (MATERIALS); INTERFACES (MATERIALS); METALLIZING; MORPHOLOGY; NICKEL ALLOYS; SCANNING ELECTRON MICROSCOPY; SURFACE REACTIONS; THERMAL EFFECTS; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

AGING TEMPERATURES; BUMP METALLIZATION; INTERFACIAL REACTIONS; SOLDER EFFECT;

SOLDERING ALLOYS;

EID: 0038498825     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0141-z     Document Type: Article

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