Modeling and design challenges and solutions for carbon nanotube-based interconnect in future high performance integrated circuits

ACM Journal on Emerging Technologies in Computing Systems

Volumn 2, Issue 3, 2006, Pages 155-196

  Massoud, Yehia ^a,b   Nieuwoudt, Arthur ^a,b  

^a RICE UNIVERSITY   (United States)

^b MS 380 ^*  (United States)

Author keywords

Carbon nanotube; Inductance; Interconnect; Nanotube bundle; Resistance

Indexed keywords

COPPER INTERCONNECTS; OHMIC RESISTANCE; SINGLE-WALLED CARBON NANOTUBE (SWCNT); STATISTICAL VARIATION;

CARBON NANOTUBES; ELECTRIC CONDUCTIVITY; ELECTROMIGRATION; EQUIVALENT CIRCUITS; INTEGRATED CIRCUITS; MATHEMATICAL MODELS;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 33750297358     PISSN: 15504832     EISSN: None     Source Type: Journal    
DOI: 10.1145/1167943.1167944     Document Type: Article

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