Empirical equations on electrical parameters of coupled microstrip lines for crosstalk estimation in printed circuit board

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 4, 2001, Pages 521-527

  Sohn, Young Soo ^a,b   Lee, Jeong Cheol ^b   Park, Hong June ^a,b   Cho, Soo In ^c  

^a IEEE   (South Korea)

^b Pohang University of Science and Technology (POSTECH)   (South Korea)

^c SAMSUNG Electronics   (South Korea)

Author keywords

Crosstalk; Empirical; Interconnect; Microstrip line; Mutual capacitance; Mutual inductance; Printed circuit board; Signal integrity; Transmission line

Indexed keywords

MUTUAL CAPACITANCE; MUTUAL INDUCTANCE; ON-CHIP INTERCONNECTS;

CAPACITANCE; COMPUTER SIMULATION; CROSSTALK; CURRENT VOLTAGE CHARACTERISTICS; CURVE FITTING; DIELECTRIC MATERIALS; DIFFERENTIAL EQUATIONS; INDUCTANCE; MATRIX ALGEBRA; PRINTED CIRCUIT BOARDS; VLSI CIRCUITS;

MICROSTRIP LINES;

EID: 0035521271     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.982839     Document Type: Article

References (11)

1. Simple formulas for two- and three-dimensional capacitance
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3. Capacitance calculation in MOSFET VLSI
4. A simple formula for the estimation of the capacitance of two-dimensional interconnects in VLSI circuits
5. Inductance and capacitance analytic formulas for VLSI interconnection
6. Inductance calculation in a complex integrated circuit environment
7. The inductance of a superconducting strip transmission line
8. On the limitation of the weak-coupling assumption for crosstalk analysis based on quasi-TEM propagation