RF/wireless interconnect for inter- and intra-chip communications

Proceedings of the IEEE

Volumn 89, Issue 4, 2001, Pages 456-465

  Chang, Mau Chung Frank ^a   Roychowdhury, Vwani P ^a   Zhang, Liyang ^a   Shin, Hyunchol ^a   Qian, Yongxi ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Adaptive networking; Bidirectional interconnect; Fault tolerant computing; Inter And intra chip communications; Interconnect reconfiguration; Multi i o interconnect; RF wireless interconnect; Ultrabroad bandwidth

Indexed keywords

EID: 3142547915     PISSN: 00189219     EISSN: None     Source Type: Journal    
DOI: 10.1109/5.920578     Document Type: Article

References (20)

1. J. D. Meindl, "Integration limits on 21st century gigascale integration," in IEEE Interconnect Technology Conf. Short Course, San Francisco, CA, May 31, 1998.
2. K. C. Saraswat and F. Moharamadi, "Effect of interconnection scaling on time delay of VLSI circuits," IEEE Trans. Electron Devices, vol. 29, pp. 645-650, 1982.
3. M. T. Bohr and Y. A. El-Mansy, "Technology for advanced highperformance microprocessors," IEEE Trans. Electron Devices, vol. 45, pp. 620-625, 1998.
4. D. A. B. Miller and H. M. Ozaktas, "Limit to the bit-rate capacity of electrical interconnects from the aspect ratio of the system architecture," J. Parallel Distrib. Compuit. (Special Issue on Parallel Computing with Optical Interconnects), vol. 41, pp. 42-52, 1997,
5. The National Technology Roadmap for Semiconductors, Semiconductor Industry Association, p. 11, 1997.
6. M. Y. Frankel et al, "Terahertz attenuation and dispersion characteristics of coplanar transmission lines," IEEE Trans. Microwave Theory Tech., vol. 39, June 1991.
7. H. Arai and T. Itoh, "Proximity coupled power combiner/divider using parasitic element," in 1997 Asia-Pacific Microwave Conf. Dig., 1997, pp. 1133-1136.
8. K. C. Gupta et al., Computer-Alded Design of Microwave Circuits. Norwell, MA: Artech House, 1981, p. 69.
9. G. Hasnain et al., "Dispersion of picosecond pulses in coplanar transmission linos," IEEE Trans. Microwave Theory Tech., Vol. 34, pp. 738-741, June 1989.
10. K. Fchcr, Digital Communications. Fnglcwood Cliffs, NJ; Prentice-Hall, 1981.
11. A. J. Viterbi, COMA Principles of Spread Spectrum Communication. Reading, MA: Addison-Wesley, Communication Series, June 1995.
12. D. Bravo, H. Yoon, K. Kim, B. Floyd, and K. O, "Estimation of signal-to-noise ratio for on-chip wireless clock signal distribution," in Proc. IEEE Int. Interconnect Technology Conf., San Francisco, CA, June 2000, pp. 9-11.
13. H. Wang et al, "A 155-GHz monolithic low-noise amplifier," IEEE Trans. Microwave Theory Tech., vol. 46, Nov. 1998.
14. R. Lai et al., "An InP HEMT MMIC LNA with 7.2 dB gain at 190GHz," IEEE Microwave Guided Lett., vol. 11, Nov. 1998.
15. Y. Mii et al, ''Experimental high performance sub-0.1μm channel MOSFETs," IEEE Electron Device Lett., vol. 15, pp. 28-30, 1994.
16. D. R. Pehlke, A. Burstein, and M. F. Chang, "Extremely high-Q tunable inductor for Si-based RF integrated circuit applications," in Dig. 1997 Int. Electron Devices Meeting, Washington, DC, 1997, pp. 63-66.
17. L. P. B. Katehi and K. Herrick, "Si-micromachining in MM-wave circuits," in Proc. 1997 Topical Symp. Millimeter Waves, New York, 1997, pp. 85-88.
18. M. F. Chang et al, "Multi-L/O and reconfigurable RF/wireless interconnect based on near field capacitive coupling and multiple access techniques," in Proc. IEEE Int. Interconnect Technol. Conf., San Francisco, CA, June 2000, pp. 21-22.
19. R. Farjad-Rad, K. Yang, M. Horowitz, and T. Lee, "A 0.4 mm CMOS 10Gb/s 4-PAM pre-emphasis serial link transmitter," in Symp. VLSI Circuits Digest Tech. Papers, 1998, pp. 198-199.
20. J. R. Heath, P. J. Kuekes, G. Snider, and R. S. Williams, "A defect tolerant computer architecture: Opportunities for nanotechnology," Science, vol. 280, p. 1717, 1998.