Comparisons of conventional, 3-D, optical, and RF interconnects for on-chip clock distribution

IEEE Transactions on Electron Devices

Volumn 51, Issue 2, 2004, Pages 233-239

  Chen, Kuan Neng ^a   Kobrinsky, Mauro J ^b   Barnett, Brandon C ^b   Reif, Rafael ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

Clock distribution; Interconnect; Optical; Radio frequency (RF); Three dimensional (3 D)

Indexed keywords

CALCULATIONS; CAPACITANCE; COMPUTER SIMULATION; ELECTRIC RESISTANCE; INTEGRATED OPTOELECTRONICS; OPTICAL WAVEGUIDES; PERMITTIVITY; SEMICONDUCTING SILICON;

CLOCK SKEW; ON CHIP CLOCK DISTRIBUTION; RADIO FREQUENCY INTERCONNECT;

TIMING CIRCUITS;

EID: 1042289267     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2003.821567     Document Type: Article

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