Electrical performance of single and coupled cu interconnects for the 70 nm technology

Proceedings - 8th IEEE Workshop on Signal Propagation on Interconnects

Volumn , Issue , 2004, Pages 189-191

  Elbouazzati, K ^a   Ponchel, F ^a   Legier, J F ^a   Paleczny, E ^a   Seguinot, C ^a   Deschacht, D ^b  

^a INSTITUT D ELECTRONIQUE   (France)

^b LIRMM   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ASYMPTOTIC STABILITY; CAPACITANCE; COPPER; CROSSTALK; DIELECTRIC MATERIALS; ELECTRIC CONDUCTIVITY; FINITE ELEMENT METHOD; GRAIN BOUNDARIES; INDUCTANCE; MOSFET DEVICES; PERMITTIVITY; SKIN EFFECT; SWITCHING NETWORKS; WAVE PROPAGATION;

NANOMETER TECHNOLOGY; PROPAGATION DELAY; SINUSOIDAL SIGNALS; WAVE ANALYSIS;

INTERCONNECTION NETWORKS;

EID: 10044256573     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. "International Technology Roadmap for Semiconductor", ≪ http://public.itrs.net/ ≫
2. C. Y. CHANG: "The highlight in the nanoworld", Proceedings of the IEEE, Vol 91 No11, November 2003, pp 1756-1763
3. st century", Proceedings of the IEEE, Vol 89 No.3, March 2001, pp 305-324
4. Kemnei BL: "Mise en æuvre d'une méthode d'éléments finis à éléments d'arêtes. Applications aux lignes de topologie complexes pour circuits intégrés monolithiques microondes et aux interconnexions sur circuit silicium", Thèse de doctorat de l'université des sciences et technologies de LILLE, le 14-10-1999, No. 2584
5. J.D. MEINDL, J.A.DAVIS, P. ZARKESH-HA, C.S. PATEL, K.P. MARTIN, P.A. KHOL: " Interconnect opportunities for gigascale integration", IBM journal of research and development, Vo146 No.2/3, March/May 2002