Mixed assembly on PCB of wide variety components (MCM-D, SMDS, bare dies) using wire bonding and SMT

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1671-1674

  Stoukatch, Serguei ^a   Vaesen, Kristof ^a   Meng, Ho Hong ^a   Beyne, Eric ^a  

^a IMEC   (Belgium)

Author keywords

Compatibility; Conductive adhesives as solder replacement; Mixed assembly; Selection of bonding wires; SMT; Wire bonding

Indexed keywords

WIRE BONDING INTERCONNECTIONS;

ADHESIVES; HEAT TREATMENT; INTERCONNECTION NETWORKS; PHASE LOCKED LOOPS; PRINTED CIRCUIT MANUFACTURE; SOLDERING ALLOYS; THIN FILMS;

PRINTED CIRCUIT BOARDS;

EID: 0036294960     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2002.1008332     Document Type: Conference Paper

References (3)

1. Chip scale review
2. Solder alternative: Conductive adhesives with stable contact resistance
3. Adhesives, epoxies and dispensing